Apple iPhone 17 Series to use RCC on motherboards to free up crucial internal space

Space has always been a constraint in smartphones preventing OEMs from adding features and technology to their devices. One such dilemma is the use of traditional PCBs that have a bonding sheet resembling green, grey, or black nonconductive material, and the entire contraption makes the PCBs thick. Turns out Apple is testing out a resin-coated copper-based PCBS that will bring down the thickness of these PCBs enabling Apple to use the available space preferably for a bigger battery.

According to a previous report, Apple was expected to move to resin-coated copper (RCC) based motherboards from the iPhone 16 lineup. However, TF International Securities analyst Ming-Chi Kuo, clarified that it won’t be feasible at least with the iPhone 16 lineup. It is because RCC has ‘fragile characteristics’ that would make the motherboard breakable during drop tests. Thus, Apple is expected to improve on the tech until Q3 2024 followed by integration on iPhone 17 series in 2025.

Using RCC would allow Apple to gain critical real estate under the phone’s chassis. This will allow the Cupertino-based giant to use the available space for more tech including a bigger battery. For instance, Apple would’ve been able to include a larger battery on the iPhone 15 and 15 Pro, both of which use a 6.1” display that translates into a smaller form factor. On the contrary, the iPhone 15 Plus and iPhone 15 Pro Max already have a bigger battery thanks to the more space available after fitting in 6.7” displays.

It remains to be seen if Apple decides to use RCC-based motherboards on the iPhone 17 Pro series or if it will be available across the lineup. We are quite sure that Apple won’t roll out the tech unless it is durable and can withstand the drop tests.

Apple iPhone 15 Pro Max recently made headlines after it failed the survival bend test even with a grade 5 titanium frame in use. However, the Cupertino-based giant was quick to address the issues and clarify that it was not because of the titanium frame and neither the reduced cooling area that caused the phone to break away.

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